Huawei S5720‑56C‑HI‑AC Full English Product Description
Product Overview
Huawei S5720‑56C‑HI‑AC is a high‑density agile high‑end Layer‑3 managed switch of S5720‑HI series, built on Huawei VRP operating system with fully‑programmable ENP chip architecture. It provides 48×10/100/1000BASE‑T RJ45 copper access ports, 4×10GE SFP+ high‑speed uplink ports, one rear service expansion slot and dedicated iStack stacking‑card slot. Adopting hot‑swappable dual‑AC‑power slots and pluggable fan modules, it supports large‑capacity 128K MAC address table, comprehensive Layer‑2/Layer‑3 routing suite, MPLS VPN, OpenFlow‑enabled programmable forwarding, iStack hardware stacking, SVF super virtual fabric, built‑in WLAN AC capability, enhanced security control and rich O&M functions. Standard 19‑inch 1U rack‑mount chassis fits medium‑large campus core, enterprise aggregation, large‑branch gateway and small‑size data‑center access scenarios. This is non‑PoE model.
Key Features
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Port & Expansion Configuration
48×10/100/1000BASE‑T copper ports for high‑density gigabit terminal access. 4 fixed 10GE SFP+ ports deliver high‑bandwidth 10‑gigabit uplink capacity. One rear expansion slot supports optional 4‑port‑10GE‑SFP+ interface card; dedicated slot supports iStack stacking card for flexible capability expansion. PoE function is not supported. Hot‑swappable dual‑AC‑power slots support 1+1 power redundancy; pluggable fan modules support easy replacement and on‑site maintenance. Service ports provide common‑mode surge protection for stable enterprise networking.
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Rich Layer‑2 Functions
Supports 4094 IEEE 802.1Q VLANs, Super‑VLAN, MUX VLAN, Voice VLAN, Guest VLAN, GVRP, VLAN mapping and flexible QinQ. Supports STP/RSTP/MSTP, VBST, Smart‑Link, RRPP and ERPS ring‑protection protocols for millisecond‑level link recovery. Supports LACP link aggregation, E‑Trunk, IGMP Snooping v1/v2/v3, MLD Snooping, multicast VLAN, broadcast/multicast/unicast storm suppression and port isolation. iStack hardware stacking merges multiple physical switches into one logical unit for unified management. Supports SVF super virtual fabric to virtualize downstream access switches and APs into remote line‑cards of parent device for simplified network O&M.
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Advanced Layer‑3, IPv6 & MPLS Functions
Supports static routing, RIP, OSPF, OSPFv3, IS‑IS, IS‑ISv6, BGP, BGP4+, VRRP, VRRPv3 and ECMP equal‑cost routing. Supports multicast routing including PIM‑DM, PIM‑SM, PIM‑SSM and MSDP. Full IPv4/IPv6 dual‑stack covers ND, Ping, Tracert, IPv6 ACL and IPv6 QoS. Supports MPLS L2VPN and L3VPN for multi‑service converged networking. MAC address table supports up to 128K entries for large‑scale deployment. Benefiting from fully‑programmable ENP chip and OpenFlow 1.3, users can customize forwarding behaviors via open programming interfaces to develop personalized protocol features without hardware upgrade.
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Enhanced Comprehensive Security Mechanism
Supports 802.1X authentication, MAC‑based authentication, AAA/RADIUS/HWTACACS portal authentication, NAC access control, port security, DHCP Snooping, ARP anti‑attack and anti‑DoS protection. L2‑L4 ACL implements flexible traffic filtering; SSHv2 and HTTPS guarantee secure management access. Built‑in WLAN AC function can manage large quantity of wireless APs, simplifying WLAN deployment for enterprise campus network.
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Powerful QoS and O&M Capabilities
8 priority queues per port, supporting SP / WRR / DRR / WFQ / SP+WRR queue‑scheduling algorithms. Supports port‑based rate‑limiting, two‑rate three‑color CAR, 802.1p / DSCP remarking. Supports Console CLI, Mini‑USB console, Web‑GUI, Telnet, SSH, SNMP v1/v2c/v3, RMON, sFlow, NetStream, virtual cable test, iPCA network quality perception, and compatible with eSight network management system. Supports EEE energy‑efficient Ethernet technology and Dying‑gasp power‑failure alarm function for high‑reliability operation.
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Hardware Design
Intelligent temperature‑adjustable pluggable fan cooling; hot‑swappable dual‑AC‑power slots support 1+1 power redundancy. Standard 19‑inch 1U rack‑mountable chassis华为企业业....
Technical Specifications
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Part Number: S5720‑56C‑HI‑AC
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Switching Capacity: 598 Gbps
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Forwarding Performance: 192 Mpps
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MAC Address Table: 128K entries
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Memory: 4GB SDRAM, 512MB Flash
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Ports: 48 × 10/100/1000BASE‑T RJ45; 4 × 10GE SFP+; 1 × rear expansion slot; 1 × stacking‑card slot
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Power Input: Hot‑swappable AC 100‑240 V, 50‑60 Hz, support 1+1 power redundancy
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Thermal Design: Pluggable intelligent temperature‑adjustable fan modules
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Max Power Consumption: 172.7 W
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Dimension: 442 mm × 420 mm × 43.6 mm (1U)
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Operating Temperature: 0 °C ~ +45 °C
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Humidity: 5%‑95% non‑condensing
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Compliance: IEEE 802.3 series Ethernet standards, OpenFlow 1.3
Compatible Hardware
Workstations, IP phones, wireless terminals; upstream switches, routers, Huawei 10GE SFP+ optical modules & DAC/AOC cables, matching hot‑swappable AC power modules, fan units, 4‑port‑10GE‑SFP+ interface card and iStack stacking card.
Note: This is HI non‑PoE high‑end agile‑enhanced switch. It doesnotsupport PoE power supply. It supports fully‑programmable ENP chip, OpenFlow 1.3, MPLS VPN, built‑in WLAN AC function, large‑capacity 128K MAC table, QinQ, multicast routing, hot‑swappable power & fan redundancy, iStack stacking and SVF super virtual fabric.
Application Scenarios
Medium‑and‑large‑size campus core layer, enterprise aggregation layer, large‑branch office gateway and small‑scale data‑center access scenarios requiring agile custom service, MPLS VPN, integrated WLAN management, full Layer‑3 routing and high‑reliability 10‑gigabit uplink.
Short Version (For Invoice / E‑commerce Listing)
Huawei S5720‑56C‑HI‑AC, S5720‑HI series non‑PoE high‑end agile full Layer‑3 managed switch, 48×GE RJ45 ports, 4×10GE SFP+ uplinks, 1×rear expansion slot, 1U rack‑mount with hot‑swappable dual‑power & fan slots, supports fully‑programmable ENP chip, OpenFlow1.3, MPLS VPN, built‑in WLAN AC, iStack stacking, OSPF/BGP/VRRP, IPv4/IPv6 dual‑stack and Web/CLI/SNMP management, ideal for campus core, enterprise aggregation and large‑branch gateway networking.
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