Huawei CloudEngine S5732‑H44S4X6QZ‑V2 Full English Product Description

Product Overview

Key Features

1. Port and Hardware Configuration

   44×GE SFP slots support FE/GE optical transceivers; 4×10GE SFP+ slots accept 10‑Gigabit optical modules; 6×40GE QSFP+ ports are available for high‑bandwidth uplink or iStack hardware stacking connection. One independent service expansion slot supports optional service cards to extend uplink and stacking capacity. Dual hot‑swap modular power slots implement 1+1 power redundancy, compatible with 600W AC, 240V high‑voltage‑DC and ‑48V DC power modules. Hot‑swappable fan modules adopt front‑to‑back airflow; intelligent variable‑speed fan dynamically adjusts rotation speed to balance heat dissipation and acoustic noise. PoE function is not supported. Both power and fan modules support hot‑swap without interrupting running services.
2. Rich Layer‑2 Functions

   Supports 4094 IEEE 802.1Q VLANs, MUX VLAN, Voice VLAN, Guest VLAN, GVRP and VLAN mapping. Implements STP/RSTP/MSTP, Smart‑Link and RRPP ring‑protection protocols for millisecond‑level link fail‑over recovery. Supports LACP link aggregation, IGMP Snooping v1/v2/v3, MLD Snooping, broadcast‑multicast‑unicast storm suppression and port isolation. iStack hardware stacking consolidates multiple physical switches into one logical device for unified configuration and management. SVF super virtual fabric simplifies campus network architecture and reduces deployment and O&M workloads.
3. Full Layer‑3, IPv6 and Virtualization Functions

   Supports static routing, RIP, OSPF, OSPFv3, VRRP, ECMP equal‑cost routing, as well as mature multicast protocols including PIM‑DM, PIM‑SM, PIM‑SSM and MSDP. Complete IPv4/IPv6 dual‑stack covers ND, Ping, Tracert, IPv6 ACL and IPv6 QoS. Supports VXLAN network virtualization with L2/L3 gateway and BGP‑EVPN capability, realizing multi‑service bearing on campus networks. Free‑mobility service follow‑through ensures consistent user access policy across the whole network. Embedded onboard AC can centrally manage up to 1024 APs to realize deep integration of wired‑wireless services. MAC address table supports up to 128K entries for large‑scale forwarding capacity.
4. Comprehensive Security Mechanism

   Supports 802.1X authentication, MAC‑based authentication, Portal authentication, AAA / RADIUS / HWTACACS and NAC access control. Provides DHCP Snooping, ARP anti‑attack, DoS‑attack defense, black‑hole MAC entries and MAC‑address‑learning‑limit control. Built‑in security probe supports abnormal traffic detection, encrypted‑traffic threat analysis and network‑wide threat trapping. L2‑L4 ACL realizes flexible traffic filtering; SSHv2 and HTTPS guarantee secure encrypted device management access.
5. Powerful QoS and Intelligent O&M Capabilities

   8 priority queues per port, supporting SP / WRR / WFQ / SP+WRR queue‑scheduling algorithms. Supports port‑based rate‑limiting, two‑rate three‑color CAR, 802.1p / DSCP remarking. Provides Console port, Mini‑USB console, Web‑GUI, Telnet, SSH, SNMP v1/v2c/v3, RMON, NetStream traffic sampling and Telemetry real‑time data collection. Compatible with eSight and iMaster NCE‑Campus network‑management platforms. Supports PNP zero‑touch deployment and iPCA packet‑loss‑monitoring function to lower on‑site maintenance complexity. Supports EEE energy‑efficient Ethernet for low‑power‑consumption operation.
6. Hardware Design

   Hot‑swappable fan modules with front‑to‑back airflow; dual hot‑swap modular power‑supply slots supporting 1+1 redundancy. Standard 19‑inch 1U rack‑mountable chassis.

Technical Specifications

• Part Number: S5732‑H44S4X6QZ‑V2
• Switching Capacity: 2.56 Tbps
• Forwarding Performance: 678 Mpps华为企业业...
• RAM: 4 GB; Flash: 2 GB
• Ports: 44 × 100/1000BASE‑X GE SFP; 4 × 10GE SFP+; 6 × 40GE QSFP+; 1 × service expansion slot
• PoE: Not supported
• Power Supply: Dual hot‑swap modular power slots, support 1+1 redundancy for AC / high‑voltage‑DC / ‑48V DC power modules
• Thermal Design: Hot‑swap fan modules, intelligent variable‑speed fan cooling, front‑to‑back airflow
• Dimension (H×W×D): 43.6 mm × 442 mm × 420 mm (1U rack‑mount)
• Operating Temperature: 0 °C ~ +45 °C
• Humidity: 5%‑95% non‑condensing
• Compliance: IEEE 802‑series Ethernet standards

Compatible Hardware

Note: This is high‑density enhanced‑version all‑optical aggregation‑grade switch without PoE function, equipped with onboard AC, expansion slot and 1+1 redundant power capability. It supports iStack stacking, SVF, VXLAN/BGP‑EVPN, service free‑mobility, full Layer‑3 routing and complete IPv4/IPv6 dual‑stack capability.

Application Scenarios

Short Version (For Invoice / E‑commerce Listing)