Huawei CloudEngine S6320‑28X‑HI Full English Product Description

Product Overview

Key Features

1. Port and Hardware Configuration

   24×10GE SFP+ multi‑rate optical slots support GE /10GE SFP/SFP+ transceivers for flexible downlink access. 4×25GE SFP28 ports support 1G‑25G rate‑adaptation, available for high‑bandwidth uplink or iStack hardware stacking connection. One independent service expansion slot supports various optional sub‑cards to extend uplink bandwidth and stacking capacity. It adopts dual hot‑swappable modular power‑supply slots, supporting 1+1 power redundancy, compatible with AC or ‑48V DC power modules. Hot‑swappable fan modules adopt front‑to‑back airflow; intelligent variable‑speed fan dynamically adjusts rotation speed to balance heat dissipation and acoustic noise. PoE power supply is not supported. Both power and fan modules support hot‑swap without interrupting running services. Standard 19‑inch 1U rack‑mount chassis for cabinet installation.
2. Rich Layer‑2 Functions

   Supports 4094 IEEE 802.1Q VLANs, MUX VLAN, Voice VLAN, Guest VLAN, GVRP and VLAN mapping. Implements STP/RSTP/MSTP, Smart‑Link, RRPP, ERPS and SEP ring‑protection protocols for millisecond‑level link fail‑over recoveryHuawei Car.... Supports LACP link aggregation, IGMP Snooping v1/v2/v3, MLD Snooping, broadcast‑multicast‑unicast storm suppression and port isolation. iStack hardware stacking merges multiple physical switches into one logical device for unified configuration and management. SVF super virtual fabric simplifies campus network architecture and reduces deployment and O&M workloads. Supports VBST protocol for seamless inter‑operation with PVST+ compatible third‑party devices.
3. Full Layer‑3, IPv6 and Virtualization Functions

   Supports static routing, RIP, OSPF, OSPFv3, VRRP, ECMP equal‑cost routing, as well as mature multicast protocols including PIM‑DM, PIM‑SM, PIM‑SSM and MSDP. Complete IPv4/IPv6 dual‑stack covers ND, Ping, Tracert, IPv6 ACL and IPv6 QoS. Supports hardware‑accelerated VXLAN and BGP‑EVPN virtualization for multi‑tenant service bearing. Service Free‑Mobility guarantees consistent user access policy across whole network. Delivers full‑feature MPLS suite including MPLS‑L3VPN, VLL and VPLS for metropolitan‑network servicesHuawei Car.... Hardware‑based BFD implements fast fault detection and convergence. MAC address table supports large‑scale forwarding capacity for campus and data‑center traffic.
4. Comprehensive Security Mechanism

   Supports 802.1X authentication, MAC‑based authentication, Portal authentication, AAA / RADIUS / HWTACACS access control. Provides DHCP Snooping, ARP anti‑attack, DoS‑attack defense, BPDU protection, root‑protection and MAC‑address‑learning‑limit control. L2‑L4 ACL realizes flexible traffic filtering based on MAC address, IP address, port number and protocol type. Supports SSHv2, HTTPS for secure encrypted management access.
5. Powerful QoS and Intelligent O&M Capabilities

   8 priority queues per port, supporting SP / WRR / DRR / SP+WRR queue‑scheduling algorithms. Supports port‑based rate‑limiting, two‑rate three‑color CAR, 802.1p / DSCP remarking and traffic shaping. Provides Console port, Mini‑USB console, Web‑GUI, Telnet, SSH, SNMP v1/v2c/v3, RMON and sFlow traffic sampling. Supports Telemetry real‑time streaming for intelligent network monitoring. Compatible with eSight and iMaster NCE‑Campus management platforms. Supports PNP zero‑touch deployment, VCT virtual‑cable‑test and Ethernet OAM for quick fault diagnosis. Supports EEE energy‑efficient Ethernet for low‑power‑consumption operation.
6. Hardware Design

   Hot‑swappable fan modules with front‑to‑back airflow; dual hot‑swap modular power‑supply slots supporting 1+1 redundancy. Standard 19‑inch 1U rack‑mountable chassis.

Technical Specifications

• Part Number: S6320‑28X‑HI
• Switching Capacity: 2.56 Tbps
• Forwarding Performance: 1080 Mpps
• Ports: 24 × 10GE SFP+ optical slots; 4 × 25GE SFP28 ports; 1 × service expansion slot
• PoE: Not supported
• Power Supply: Dual hot‑swap modular power slots, support 1+1 redundancy for AC / ‑48V DC power modules
• Thermal Design: Hot‑swap fan modules, intelligent variable‑speed fan cooling, front‑to‑back airflow
• Dimension (H×W×D): 44.4 mm × 442 mm × 420 mm (1U rack‑mount)
• Operating Temperature: 0 °C ~ +45 °C
• Humidity: 5%‑95% non‑condensing
• Compliance: IEEE 802‑series Ethernet standards

Compatible Hardware

Note: This is S6320‑HI series high‑performance flagship all‑optical full‑Layer‑3 switch without PoE function. It supports iStack stacking, SVF super virtual fabric, hardware‑accelerated VXLAN/BGP‑EVPN, Service Free‑Mobility, full‑feature MPLS, rich Layer‑2/Layer‑3 protocols and complete IPv4/IPv6 dual‑stack capabilityHuawei Car....

Application Scenarios

Short Version (For Invoice / E‑commerce Listing)