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Company Name:Kino Technology Limited
Website:www.kino86.com
Address :Room 312, Honghua Building, No. 1 Guangyayuan Road, Bantian Street, Longgang District, Shenzhen city, Guangdong Province, China
Contact Person:kiki
Tel :+8613040881925
E-mail:kiki@szkiki.com
Wechat:+8613040881925
Whatspp: +8613040881925
Teams:kiki@szkiki.com
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| Product >> Huawei >> ALL |
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Product_Id: |
879182016 |
ProductName: |
XH9030‑4C |
Specification: |
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Product Notes: |
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Product Category: |
Huawei |
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| Product Description |
Huawei CloudEngine XH9030‑4C Switch Chassis
Product Overview
The Huawei CloudEngine XH9030‑4C is a 4U modular chassis‑based AI‑optimized leaf switch from the XH9000 series, designed for large‑scale AI computing clusters and high‑performance data‑center fabrics. It provides four hot‑swappable subcard slots for flexible high‑speed interface card deployment, supporting 100GE / 200GE / 400GE port expansion. The chassis adopts separate control and forwarding architecture, supports 2+2 power supply redundancy and multiple fan modules with selectable airflow directions, delivering carrier‑grade reliability for non‑interruptible large‑model AI training workloads.
Key Features
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Modular flexible port expansion: 4 subcard slots, compatible with high‑speed interface cards such as XH90‑D32CQ‑F, to achieve high‑density 100GE/200GE/400GE port combinations, adapting to diverse GPU server interconnection requirements.
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Lossless AI‑oriented networking: Hardware supports PFC, AI‑ECN, NSLB network‑scale load balancing, iFlashboot fast reboot, and optical lane fault tolerance, avoiding AI training interruption caused by device restart or partial optical channel failure华为企业业....
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Full‑feature data‑center protocol stack: Hardware‑accelerated VXLAN, BGP‑EVPN, 1588v2 PTP, hardware BFD, DPFR and MACsec encryption, building secure and large‑scale leaf‑spine fabric networks.
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Intelligent real‑time O&M: Native Telemetry, NetStream, IFIT and ERSPAN+ capabilities, implementing millisecond‑level network telemetry and rapid fault location for massive AI cluster nodes.
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High‑reliability hardware design: 2+2 hot‑swappable redundant power modules, multiple hot‑swap fan units; supports AC, ‑48V DC and 240V HVDC power input; optional port‑side intake or port‑side exhaust airflow to adapt to different cabinet deployment environments.
Technical Specifications
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Form factor: 4U 19‑inch standard rack‑mount chassis
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Subcard slots: 4 hot‑swappable interface subcard slots
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Management ports: 1×RJ45 Console port, 1×RJ45 ETH management port, 1×USB port
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CPU: 16‑core 2.0 GHz processor
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Memory: 16 GB DRAM, 4 GB SSD Flash
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Power supply: Support up to 4 power modules, 2+2 redundancy mode; compatible with AC / ‑48V DC / 240V HVDC power modules
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Fans: Multiple hot‑swappable fan modules, dual‑direction airflow optional
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Supported software version: V300R024C00 and later
Application Scenarios
Deployed as high‑density leaf access switches in large‑scale AI computing data centers and HPC clusters. Connect massive GPU compute nodes, provide high‑bandwidth lossless RoCE uplink towards spine switches, and satisfy ultra‑low‑latency and high‑stability network demands for large‑model training and inference services华为企业业....
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| Click:36 Entry Time:2026-08-07 【Print】 【Close】 |
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