|
Company Name：Kino Technology Limited
Website：www.kino86.com
Address ：Room 312, Honghua Building, No. 1 Guangyayuan Road, Bantian Street, Longgang District, Shenzhen city, Guangdong Province, China
Contact Person：kiki
Tel ：+8613040881925
E-mail：kiki@szkiki.com
Wechat:+8613040881925
Whatspp: +8613040881925
Teams:kiki@szkiki.com
|
|
|
| Product >> Huawei >> ALL |
| |
|
Product_Id： |
879275416 |
ProductName： |
CE16808 |
Specification： |
|
Product Notes： |
|
Product Category： |
Huawei |
| |
|
| Product Description |
Huawei CloudEngine CE16808 Switch Chassis
Product Overview
The Huawei CloudEngine CE16808 is a high‑end modular spine/core chassis switch from the CloudEngine 16800 series, purpose‑built for hyperscale AI computing clusters, large‑scale cloud data centers and high‑performance computing networks. It adopts a backplane‑free Clos cell‑switching architecture with independent control, forwarding and monitoring planes, equipped with built‑in AI chips to run the iLossless intelligent lossless algorithm. The chassis provides 8 hot‑swappable service line‑card slots, supporting high‑density 100GE / 400GE / 800GE interfaces. All core components are hot‑swappable, delivering carrier‑grade reliability for mission‑critical large‑model training and multi‑tenant cloud fabric services.
Key Features
-
Massive high‑density port capacity: 8 service line‑card slots, supporting up to 384×100GE, 192×400GE or 96×800GE line‑rate ports, satisfying ultra‑large bandwidth demands of AI‑era data‑center spine layers.
-
AI‑driven zero‑loss lossless networking: On‑board AI chip executes iLossless algorithm for real‑time full‑network traffic optimization. Combined with PFC, ECN and RoCE‑v2, it achieves near‑zero packet loss and microsecond‑level end‑to‑end latency for RDMA‑based AI cluster workloads.
-
Full‑feature data‑center protocol stack: Hardware‑accelerated VXLAN bridging & routing, BGP‑EVPN, CSS cluster virtualization, VS device virtualization, M‑LAG, IEEE 1588v2 PTP, hardware‑based BFD and MACsec encryption, supporting large‑scale leaf‑spine fabric and cross‑data‑center DCI interconnection.
-
Intelligent automated O&M: High‑precision millisecond‑level native Telemetry, IFIT, NetStream and predictive fault analysis, realizing rapid fault location and reducing O&M pressure for massive‑node data‑center networks.
-
Carrier‑grade modular redundancy: 1+1 hot‑swappable MPU main control units, N+M redundant fabric modules, N+1 hot‑swap power supplies and fan trays. Supports AC, ‑48V DC and 240V‑380V HVDC power input; strict fixed front‑to‑back airflow design for stable cabinet heat dissipation.
Technical Specifications
-
Form factor: 15.8U standard 19‑inch rack‑mount chassis
-
Service line‑card slots: 8 hot‑swappable LPU slots
-
Fabric module slots: Multiple hot‑swap SFU slots with N+M redundancy
-
Main control units: 2 slots, 1+1 hot‑swap backup
-
Management interfaces: RJ45 Console port, ETH management port, USB port
-
Switching architecture: Backplane‑free Clos cell‑switching, VoQ virtual output queuing
-
Airflow: Fixed front‑to‑back airflow
-
Power modules: Up to 10 hot‑swappable power slots, N+1 redundancy; supports AC / ‑48V DC / HVDC power supply
-
Fan trays: Hot‑swappable, N+1 redundant
-
Software system: VRP8 platform
Application Scenarios
Primarily deployed as high‑end spine core switches in hyperscale cloud data centers, large‑scale AI computing clusters and HPC environments. It undertakes high‑speed aggregation and forwarding of massive leaf‑switch traffic, provides lossless RoCE networking for AI large‑model training, and supports multi‑tenant VXLAN‑EVPN fabric and cross‑data‑center interconnection services.
|
|
|
| Click：29 Entry Time：2026-08-07 【Print】 【Close】 |
|
|
|
|
